Failure Analysis Engineer

Job Req ID: 26963

About Supermicro:

Supermicro® is a Top Tier provider of advanced server, storage, and networking solutions for Data Center, Cloud Computing, Enterprise IT, Hadoop/ Big Data, Hyperscale, HPC and IoT/Embedded customers worldwide. We are the #5 fastest growing company among the Silicon Valley Top 50 technology firms. Our unprecedented global expansion has provided us with the opportunity to offer a large number of new positions to the technology community. We seek talented, passionate, and committed engineers, technologists, and business leaders to join us.

Essential Duties and Responsibilities:

1. Repair and Failure Analysis: Responsible for repairing abnormal boards from SMT, DIP, and FT processes.
2. Failure Mode Analysis: Analyse root causes of failures and establish a failure mode database.
3. Repair Process Planning and SOP Maintenance: Update SOP for repair processes.
4. Repair Tools and Equipment Management: Manage repair equipment (e.g., multi-meter, hot air gun, small stencil, oscilloscope, mini wave soldering, BGA rework machine), including regular calibration and ensure repair quality.
5. Repair Time and Efficiency: Track and improve average repair Time and success rate: Monitor repair cycle time, yield, and drive continuous improvement.
6. Repair Process Optimization: Improve repair workflows to reduce cycle time and minimize waiting time.Daily/Weekly/Monthly/Yearly Report: Compile and analyse data on defect types, top failure trends, repair volumes, success rates, scrap rates, and other KPIs.
7. Repair History and Tracking: Maintain detailed repair records, including serial numbers, replaced part numbers, and failure descriptions.
8. Cross-Functional Collaboration and Customer Support: Coordinate and communicate with manufacturing, production engineering, production test engineering, and quality engineering team to provide timely support for urgent and high-volume repair issues. 
9. Support and train Contract Manufacturer (CM) in preparing 8D or Failure Analysis (FA) reports for customer feedback.

Qualifications:

1. Bachelor’s degree or higher in Electrical Engineering (BSEE), Mechanical Engineering (BSME), or a related field, with at least 3~5 years of repair experience in the PCBA industry.
2. Excellent communication and interpersonal skills, with the ability to collaborate effectively across departments and with external stakeholders, including customers.
3. Strong knowledge of electronic components in PCBA, raw PCB materials, mechanical parts, and SMT/DIP/FT assembly processes.
4. Familiar with an electronic circuit schematic, demonstrate skill in electronic circuit analysis and troubleshoot.
5. Familiar rework operation in hand soldering, desoldering, small stencil, mini wave soldering machine, BGA rework machine. 
6. Good knowledge of computer/server testing and inspection.
7. Good software skills in both Windows and Linux environments. 
8. Capable of teamwork and self-motivated hard work with a positive attitude

EEO Statement